发明名称 REFLOW SOLDERING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a reflow soldering method which can prevent deficiency such as defective soldering due to a decrease in the velocity of atmosphere gas circulated in a furnace and so on. <P>SOLUTION: In the reflow soldering method, the atmosphere gas controlled to a prescribed temperature is circulated in the furnace 1 by means of a blower 8, and soldering is performed by conveying a substrate 7 mounted with electronic parts, by means of a conveyor 6 controlled to a prescribed speed in the furnace 1. To manage the atmosphere gas velocity, the rotational speed of the drive motor 9 of the blower 8 is detected and whether or not the atmosphere gas velocity is normal is determined on the basis of the detection signal of the velocity of the atmosphere gas. If the atmosphere gas velocity is judged abnormal, it is preferable to indicate such judgment. Instead of the above, the atmosphere gas velocity may be controlled by detecting the rotational speed of the drive motor 9 of the blower 8 and keeping the rotational speed of the drive motor at the prescribed speed according to the detection signal. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011020168(A) 申请公布日期 2011.02.03
申请号 JP20090169744 申请日期 2009.07.21
申请人 YOKOTA TECHNICA:KK 发明人 YOKOTA HACHIJI
分类号 B23K3/04;B23K1/00;B23K1/008;B23K101/42;H05K3/34 主分类号 B23K3/04
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