| 摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base having a through-conductor spanning the height of the base, and having an insulator protecting the base and the through-conductor; mounting a chip over the base and connected to the base with a first interconnect; forming a second interconnect above the base and horizontally beside the chip; and encapsulating the chip, the first interconnect, and the second interconnect with an encapsulation. |
