PLASMA STAMP AND METHOD FOR PLASMA TREATING A SURFACE

摘要

The invention relates to a plasma stamp having at least one cavity, at least one opening, before which a substrate to be treated can be arranged, a dielectrical floor arranged opposite the opening and a wall that is electrically conductive at least in regions arranged between the opening and the floor as a first electrode and having a second electrode which is arranged on a side of the floor averted from the cavity.