NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD

摘要

Provided is a negative photosensitive resin composition containing a photopolymerizable monomer, a photopolymerization initiator, and a polyimide precursor resin, said polyimide precursor resin formed by condensation-polymerizing a carboxylic acid anhydride component, which contains an aromatic tetracarboxylic dianhydride, and a diamine component, which contains an aromatic diamine. The photopolymerizable monomer, which constitutes 0.05% to 15% by weight of the total solid content of the negative photosensitive resin composition, is a compound which has a photoreactive functional group and a glycidyl group. This allows the provision of a negative photosensitive resin composition wherein unexposed areas have excellent solubility in a developing solution, and for exposed areas, the amount of film degradation in a developing solution is low. Also provided are a printed circuit board and a polyimide resin film using the aforementioned negative photosensitive resin composition.