| 摘要 |
A light-emitting diode (LED) cutting method includes the following steps: (A) positioning and retaining an LED chip or an LED epitaxial substrate on a chip retainer; (B) introducing a liquid medium to serve as a sound wave reflection layer medium between a cutting tool and the chip; (C) activating a power source to drive a magnetostrictive or piezoelectric ceramic material mounted on a machine to serve as a power source by inducing volume expansion/compression that generates up-and-down piston-like movement; and (D) operating the cutting tool of a proper shape that has a surface on which super hard micro-particles of diamond, CBN, or SiC are electroformed to carry out up-and-down piston-like reciprocal motion on the material retained on the chip retainer to drive the super hard micro-particles on the surface of the cutting tool into a pre-cut workpiece to perform breaking cutting.
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