| 摘要 |
Provided is a surface inspecting method for inspecting a surface of a semiconductor substrate having linear line patterns repeatedly arranged and hole-shaped hole patterns formed on the line patterns. The surface inspecting method has a setting step (S101) of setting inspecting conditions; an illuminating step (S102) of irradiating the surface of the semiconductor substrate with illuminating step under the inspecting conditions set in the setting step; a detecting step (S103) of detecting diffracted light from the semiconductor substrate irradiated with illumination light; and an inspecting step (S104) of inspecting existence/nonexistence of a defect on the hole patterns, based on the diffracted light detected in the detecting step. In the setting step, the inspecting conditions are to be set so that the travelling direction of illumination light on the surface of the semiconductor substrate is different from the repeated arrangement direction of the line patterns and that such travelling direction substantially matches the repeated arrangement direction of the hole patterns.
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