METAL PATTERNING FOR ELECTRICALLY CONDUCTIVE STRUCTURES BASED ON ALLOY FORMATION
摘要
Layered metal structures are patterned to form a surface with some locations having an alloy along the top surface at some locations and the original top metal layer at other locations along the surface. The alloy and original top metal layer can be selected to have differential etching properties such that the pattern of the alloy or original metal can be selectively etched to form a patterned metal interconnect. In general, the patterning is performed by localized heating that drives formation of the alloy at the heated locations. The metal patterning can be useful for solar cell applications as well as for electronics applications, such as display applications.
申请公布号
WO2010135178(A3)
申请公布日期
2011.02.03
申请号
WO2010US34860
申请日期
2010.05.14
申请人
NANOGRAM CORPORATION;SRINIVASAN, UMA;PAKALA, NEERAJ;SANDERS, WILLIAM, A.;HIESLMAIR, HENRY
发明人
SRINIVASAN, UMA;PAKALA, NEERAJ;SANDERS, WILLIAM, A.;HIESLMAIR, HENRY