发明名称 ELECTRONIC COMPONENT-MOUNTING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component-mounting device that eliminates an influence of bending of a suction nozzle to thereby precisely mount an electronic component. <P>SOLUTION: The electronic component-mounting device includes a position measuring means for measuring the position of the sucked electronic component relative to the suction nozzle by an X-direction light reception width of incident light along a Y-axial direction, and an operation control means for performing mounting operation control. The electronic component-mounting device further includes an allowable maximum acceleration storage means for storing, for each electronic component, allowable maximum acceleration of a driving source in the X-axial direction with which the bending of the suction nozzle is within an allowable range of mounting precision requested for the each electronic component. The operation control means acquires the allowable maximum acceleration of the driving source in the X-axial direction from the allowable maximum acceleration storage means according to an electronic component to be mounted, and performs control to provide a limitation period where the acceleration of the driving source in the X-axial direction is limited to the allowable maximum acceleration so as to measure the position of the electronic component by the position measuring means with respect to at least a portion of a movement period where a head is moved from a component supply part to a substrate at a substrate holding part by a head moving mechanism. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011023432(A) 申请公布日期 2011.02.03
申请号 JP20090165219 申请日期 2009.07.14
申请人 JUKI CORP 发明人 UCHITANI KENJI
分类号 H05K13/04 主分类号 H05K13/04
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