DEPOSITION METHOD USING ATOMIC LAYER DEPOSITION METHOD, AND DEPOSITION DEVICE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a deposition method in which faults in directly injecting water which is an oxidizing agent by an injection valve are eliminated, and to provide a deposition device thereof. SOLUTION: The deposition method includes: an adsorbing process of adsorbing an organic metal compound to the surface of a substrate by holding a substrate W inside, directly injecting a liquid raw material containing the organic metal compound into a deposition chamber 2 which is decompressed by a pump 71 by an injection valve 41, and vaporizing the liquid raw material by a decompression boiling phenomenon; and an oxidizing process for oxidizing the organic metal compound which is adsorbed onto the surface of the substrate by directly injecting a mixed solution of water which is the oxidizing agent and an organic solvent with smaller latent heat of vaporization than that of water into the deposition chamber 2 by the injection valve 51 and vaporizing the mixed solution by the decompression boiling phenomenon. COPYRIGHT: (C)2011,JPO&INPIT