| 摘要 |
PROBLEM TO BE SOLVED: To measure highly accurately a bonding part temperature between a circuit board and a mounted component without impeding heating efficiency of a bonding member between the circuit board and the mounted component. SOLUTION: This temperature measuring device 1 includes: a contact type temperature measuring part 2 for measuring through a thermocouple 2a, a temperature of a temperature-measuring position on the circuit board 10 excluding a bonding part between the mounted component 11 and the circuit board 10; a radiation temperature measuring part 3 for measuring in the noncontact state, a temperature distribution on a board domain including at least the bonding part and the temperature-measuring position on the circuit board 10; a temperature calculation part 7a for calculating a temperature of the bonding part between the mounted component 11 and the circuit board 10; and a display part 5 for displaying the temperature of the bonding part. The temperature calculation part 7a calculates a temperature difference between a heated bonding part of the mounted component 11 and the temperature-measuring position on the circuit board 10 based on the temperature distribution on the board domain, and calculates the temperature of the bonding part between the mounted component 11 and the circuit board 10 based on the calculated temperature difference and on the measured temperature at the temperature-measuring position. COPYRIGHT: (C)2011,JPO&INPIT
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