发明名称 |
METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD |
摘要 |
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.
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申请公布号 |
US2011027970(A1) |
申请公布日期 |
2011.02.03 |
申请号 |
US20100904023 |
申请日期 |
2010.10.13 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
IRI JUNICHIRO;KASHINO TOSHIO;INADA GENJI |
分类号 |
H01L21/78;B41J2/16;H01L21/00 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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