发明名称 PATTERN EVALUATION METHOD, DEVICE THEREFOR, AND ELECTRON BEAM DEVICE
摘要 Disclosed is a pattern evaluation device which determines the irregularities of the surface of a sample and measures the dimension thereof using the parallax induced by a beam tilt, wherein the amount of an astigmatic difference or the amount of focus displacement is calculated from the amounts of pattern displacement before and after the beam tilt after being corrected by the amount of displacement that depends on the amount of beam deflection for moving the position of image acquisition. Specifically disclosed is a pattern evaluation device which, when acquiring one SEM image, continuously changes the angle of incidence of primary electrons, and acquires an image in which the regions obtained at different angles of incidence within the same image are continuously connected, thereby determining the irregularities on the basis of the acquisition of the one image.
申请公布号 WO2011013342(A1) 申请公布日期 2011.02.03
申请号 WO2010JP04743 申请日期 2010.07.26
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION;YAMANASHI, HIROMASA;SOHDA, YASUNARI;OHASHI, TAKEYOSHI;FUKUDA, MUNEYUKI 发明人 YAMANASHI, HIROMASA;SOHDA, YASUNARI;OHASHI, TAKEYOSHI;FUKUDA, MUNEYUKI
分类号 H01J37/22;G01B15/00;H01J37/147;H01J37/21;H01J37/28;H01L21/66 主分类号 H01J37/22
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