发明名称 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
摘要 A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.
申请公布号 WO2011012475(A1) 申请公布日期 2011.02.03
申请号 WO2010EP60375 申请日期 2010.07.19
申请人 BASF SE;ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;MAYER, DIETER;HAAG, ALEXANDRA;EMNET, CHARLOTTE 发明人 ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;MAYER, DIETER;HAAG, ALEXANDRA;EMNET, CHARLOTTE
分类号 C25D3/38;C25D3/02;C25D3/40;H01L21/288;H01L21/768 主分类号 C25D3/38
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