COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
摘要
A composition comprising at least one source of metal ions and at least one additive obtainable by reacting a polyhydric alcohol comprising at least 5 hydroxyl functional groups with at least a first alkylene oxide and a second alkylene oxide from a mixture of the first alkylene oxide and the second alkylene oxide or a third alkylene oxide, a second alkylene oxide, and a first alkylene oxide in aforesaid sequence, the third alkylene oxide having a longer alkyl chain than the second alkylene oxide and the second alkylene oxide having a longer alkyl chain than the first alkylene oxide.
申请公布号
WO2011012475(A1)
申请公布日期
2011.02.03
申请号
WO2010EP60375
申请日期
2010.07.19
申请人
BASF SE;ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;MAYER, DIETER;HAAG, ALEXANDRA;EMNET, CHARLOTTE
发明人
ROEGER-GOEPFERT, CORNELIA;RAETHER, ROMAN BENEDIKT;MAYER, DIETER;HAAG, ALEXANDRA;EMNET, CHARLOTTE