发明名称 |
Stud Bumps as Local Heat Sinks During Transient Power Operations |
摘要 |
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate. |
申请公布号 |
US2011027943(A1) |
申请公布日期 |
2011.02.03 |
申请号 |
US20100906240 |
申请日期 |
2010.10.18 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
GURRUM SIVA PRAKASH;SAHASRABUDE KAPIL HERAMB;GUPTA VIKAS |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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