| 发明名称 |
Ball grid array printed circuit board, package structure, and fabricating method thereof |
| 摘要 |
A BGA (ball grid array) printed circuit board is disclosed, which includes a substrate having a dielectric layer, a BGA pad and a solder mask formed on the dielectric layer, and an adhesive glue filled in a gap between the BGA pad and the solder mask. A BGA printed circuit board package structure and a method for fabricating the BGA printed circuit board are also disclosed.
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| 申请公布号 |
US2011024173(A1) |
申请公布日期 |
2011.02.03 |
| 申请号 |
US20090585996 |
申请日期 |
2009.09.30 |
| 申请人 |
QUANTA COMPUTER INC.;TECH-FRONT (SHANGHAI) COMPUTER CO. LTD. |
发明人 |
WU JIN-CHANG;WANG WEN-BING;WANG XUN |
| 分类号 |
H05K1/16;H05K1/11;H05K3/00 |
主分类号 |
H05K1/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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