| 摘要 |
An object of the present invention is to simplify the defect inspection of an internal defect and front and rear surface defects in a wafer. A defect inspection method of the present invention includes: a first imaging step of taking a transmitted image of a wafer 1 by disposing two light source/image pickup units 4 and 5 equipped with a light source, an image pickup device and an optical system oppositely to each other across the wafer 1, irradiating infrared light from at least one of the light source/image pickup units 4 and 5 to the wafer 1, and receiving transmitted light from the wafer 1; a second imaging step of taking the respective reflected images of both wafer surfaces by irradiating infrared light or visible light from the light source/image pickup units 4 and 5 to the wafer 1 and receiving reflected light from the wafer 1; and an extraction step of extracting the defects in the wafer 1 on the basis of the transmitted image and the reflected images of both surfaces, thereby simultaneously detecting both an internal defect and front and rear surface defects in the wafer.
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