发明名称 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
摘要 High temperature performance hot melt adhesives are formulated for application at low temperatures below, i.e., below 300°F. Hot melt adhesives containing low levels of metallocene polymer together with a maleated polyethylene wax show an excellent balance of high and low temperature performance and are particularly useful as packaging case and carton adhesives.
申请公布号 WO2011014714(A2) 申请公布日期 2011.02.03
申请号 WO2010US43804 申请日期 2010.07.30
申请人 HENKEL CORPORATION;PATEL, JAGRUTI, B.;EODICE, ANDREA, KEYS;LOW, YEW, GUAN 发明人 PATEL, JAGRUTI, B.;EODICE, ANDREA, KEYS;LOW, YEW, GUAN
分类号 C09J123/08;C09J5/06;C09J123/20;C09J191/06 主分类号 C09J123/08
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