Image sensor package structure with large air cavity

摘要

The present invention discloses an image sensor package structure with a large air cavity (33). The image sensor package structure includes a substrate (10), a chip (20), a cover (30) and a package material (40). The chip (20) is combined with the substrate (10). A plastic sheet (31) of the cover (30) is adhered to the chip (20) and a transparent lid (32) of the cover (30) is combined with the plastic sheet (31) to provide a covering over a sensitization area (221) of the chip (20) so as to form an air cavity (33). The package material (40) is arranged on the substrate (10) and encapsulated around the chip (20) and the cover (30). The plastic sheet (31) having a predetermined thickness can increase the distance between the transparent lid (32) and the chip (20) to enlarge the air cavity (33). Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.