发明名称 |
WIRE AND SOLDER BOND FORMING METHODS |
摘要 |
<p>Methods of forming wire and solder bond structures are disclosed. In one embodiment, a method includes providing a structure including a wire bond metal region for the wire bond and a solder bond metal region for the solder bond; forming a protective layer over the wire bond metal region only; forming a silicon nitride layer over a silicon oxide layer over the wire bond metal region and the solder bond metal region; forming the solder bond to the solder bond metal region while maintaining the wire bond metal region covered; exposing the wire bond metal region including removing the protective layer; and forming the wire bond to the wire bond metal region. Wire bond and solder bond structures can be made accessible on a single multi-part wafer (MPW) wafer or on a single chip, if necessary.</p> |
申请公布号 |
EP2097202(B1) |
申请公布日期 |
2011.02.02 |
申请号 |
EP20070822113 |
申请日期 |
2007.10.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK, TIMOTHY HARRISON;SAUTER, WOLFGANG;GAMBINO, JEFFREY PETER;MUZZY, CHRISTOPHER DAVID |
分类号 |
B23K1/20;B23K20/24;H01L25/065 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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