Method and apparatus for processing brittle material substrate

摘要

[Object] To provide a method and an apparatus for scribing a brittle material substrate where a scribing trench can be effectively created both in the resin layer and the brittle material plate from the same side. [Means for Achieving Object] A cut trench 22 is created in a resin layer 21 from the top by means of a fixed blade 1 or a laser beam, and then the brittle material plate is scribed along the above described cut trench 22 with a cutter wheel 2 having inclining surfaces with two angles on the two sides of the blade, and thus, a scribing trench 23 is created in the brittle material plate. The above described cutter wheel 2 is provided with a blade 2a for scribing a brittle material having a large angle ± between the ridge lines in the edge portion and second inclining surfaces 2c which continue from the first inclining surfaces 2b on the left and right of the blade 2a for scribing a brittle material so that the angle ² at which the virtual lines along the left and right second inclining surfaces cross is smaller than the angle ± between the ridge lines in the above described edge portion, and thus, the two sides of the blade have inclining surfaces with two angles in the structure.