发明名称 |
Method of attaching integrated circuits to a carrier |
摘要 |
The invention provides for a method of attaching printhead integrated circuitry to a carrier. The method includes scanning a wafer having a number of circuitry dies formed thereon to demarcate respective dies, aligning a die picker with a dice on the wafer according to a wafer substrate mapping scheme, and removing the dice from the wafer with the die picker. The method further includes the steps of transporting the dice to a placement station operatively positioning the carrier, aligning the dice with the carrier; and heat bonding the dice to the carrier.
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申请公布号 |
US7877876(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20080193747 |
申请日期 |
2008.08.19 |
申请人 |
SILVERBROOK RESEARCH PTY LTD |
发明人 |
BURKE DAVID OLIVER;WASZCZUK JAN;BOYTON DESMOND BRUCE;STRUDWICKE CRAIG DONALD;SOBEY PETER JOHN MORLEY;GRANGER WILLIAM;THELANDER JASON MARK;O'DONNELL ERIC PATRICK |
分类号 |
B23P17/00 |
主分类号 |
B23P17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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