| 摘要 |
<p>PURPOSE: A light emitting package and a manufacturing method thereof are provided to improve package efficiency by applying the same current input method like a vertical chip. CONSTITUTION: A groove is formed on a substrate(110). A light emitting structure(140) is directly grown on a first region of the groove of the substrate. An electrode is formed on the substrate. A wire bonding connects an electrode to a light emitting structure. Fillers are filed in the groove. An insulation layer(120) is formed on the surface of the substrate except the first region of the groove.</p> |
