发明名称 Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
摘要 A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
申请公布号 US7878883(B2) 申请公布日期 2011.02.01
申请号 US20070621920 申请日期 2007.01.10
申请人 MEMC ELECTRONICS MATERIALS, INC. 发明人 GUPTA PUNEET;KULKARNI MILIND S.;ZAVATTARI CARLO;VANDAMME ROLAND R.
分类号 B24B49/00;B28D1/08 主分类号 B24B49/00
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