发明名称 |
Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control |
摘要 |
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
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申请公布号 |
US7878883(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20070621920 |
申请日期 |
2007.01.10 |
申请人 |
MEMC ELECTRONICS MATERIALS, INC. |
发明人 |
GUPTA PUNEET;KULKARNI MILIND S.;ZAVATTARI CARLO;VANDAMME ROLAND R. |
分类号 |
B24B49/00;B28D1/08 |
主分类号 |
B24B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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