发明名称 |
Semiconductor device and method of manufacturing semiconductor device |
摘要 |
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer. |
申请公布号 |
US7880317(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20060094314 |
申请日期 |
2006.10.30 |
申请人 |
SONY CORPORATION;SONY COMPUTER ENTERTAINMENT INC. |
发明人 |
OHDE TOMOSHI;KANAYAMA FUJIO;ADACHI MITSURU;NIIMI TETSUNORI;KUSANO HIDETOSHI;NISHITANI YUJI |
分类号 |
H01L23/28;H01L21/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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