| 摘要 |
<p>In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. A circuit device (10) has a structure where a wiring layer (20), an insulating resin layer (30) and a circuit element (40) are stacked in this order by a pressure bonding. The wiring layer (20) is provided with bump electrodes (22) in positions that correspond respectively to element electrodes of a circuit element (40). The insulating resin layer (30) is formed of a material that develops plastic flow when pressurized. The bump electrode (22) penetrates the insulating resin layer (30) and is electrically connected to a corresponding element electrode (42).</p> |
