发明名称 BONDING MACHINE INCORPORATING DUAL-TRACK TRANSFER MECHANISM
摘要 <p>PURPOSE: A junction device is provided to accurately and rapidly execute a junction process by reducing the idling time of a junction system. CONSTITUTION: A front and a rear lead frame rail are composed in order to align substrates in a vertical direction during a transfer process. A junction system(32) is located on a first junction location and a second junction location. A front indexer is located to be adjacent to the front lead frame rail. A rear indexer(30) is located to be adjacent to the rear lead frame rail. Each indexer is independently operated in order to transport the substrate along each rail. A container directly transfers non-contacted substrates to the rail.</p>
申请公布号 KR20110010575(A) 申请公布日期 2011.02.01
申请号 KR20100071342 申请日期 2010.07.23
申请人 ASM TECHNOLOGY SINGAPORE PTE LTD. 发明人 SONG KENG YEW JAMES;KWAN KA SHING KENNY;LUM CHOONG KEAD LESLIE;HE TING YU
分类号 H01L21/50 主分类号 H01L21/50
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