发明名称 |
BONDING MACHINE INCORPORATING DUAL-TRACK TRANSFER MECHANISM |
摘要 |
<p>PURPOSE: A junction device is provided to accurately and rapidly execute a junction process by reducing the idling time of a junction system. CONSTITUTION: A front and a rear lead frame rail are composed in order to align substrates in a vertical direction during a transfer process. A junction system(32) is located on a first junction location and a second junction location. A front indexer is located to be adjacent to the front lead frame rail. A rear indexer(30) is located to be adjacent to the rear lead frame rail. Each indexer is independently operated in order to transport the substrate along each rail. A container directly transfers non-contacted substrates to the rail.</p> |
申请公布号 |
KR20110010575(A) |
申请公布日期 |
2011.02.01 |
申请号 |
KR20100071342 |
申请日期 |
2010.07.23 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD. |
发明人 |
SONG KENG YEW JAMES;KWAN KA SHING KENNY;LUM CHOONG KEAD LESLIE;HE TING YU |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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