发明名称 |
Electronic component manufacturing method |
摘要 |
A method for manufacturing an electronic component on a semiconductor substrate, including forming at least one opening in the substrate; forming in the bottom and on the walls of the opening and on the substrate an alternated succession of layers of a first material and of a second material, the second material being selectively etchable with respect to the first material and the substrate; trimming the layer portions of the first material and of the second material which are not located in the opening; selectively etching a portion of the first material to obtain trenches; and filling the trenches with at least one third material.
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申请公布号 |
US7879679(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20080059497 |
申请日期 |
2008.03.31 |
申请人 |
STMICROELECTRONICS CROLLES 2 SAS |
发明人 |
KERMARREC OLIVER;BENSAHEL DANIEL;CAMPIDELLI YVES |
分类号 |
H01L21/331 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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