| 摘要 |
This invention relates to a high strength, high electrical conductivity copper alloy having excellent mechanical and physical properties, including thermal softening resistance, in which precipitate particles are finely dispersed (growth of the precipitate is suppressed), and the production process. The alloy is the precipitation suppressed copper alloy consisted of 0.5 DIFFERENCE 4.0 wt % nickel, 0.1 DIFFERENCE 1.0 wt % silicon, 0.05 DIFFERENCE 0.8 wt % tin (Sn) and balance copper and inevitable impurities, wherein sizes of precipitate particles are below 0.5 mu m. The production process includes the steps of melting and casting raw materials, surface machining and cold rolling of the ingot, subjecting the cold rolled ingot to a precipitation process at a temperature ranging 450 DIFFERENCE 520 deg. C. for 5 DIFFERENCE 12 hours, cold rolling the precipitation processed material, and subjecting the cold rolled material to a tension annealing process at a temperature ranging 350 DIFFERENCE 550 deg. C. for below 90 seconds.
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