发明名称 |
Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
摘要 |
A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.
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申请公布号 |
US7880277(B2) |
申请公布日期 |
2011.02.01 |
申请号 |
US20060485194 |
申请日期 |
2006.07.12 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SEAH ALVIN;FERNANDEZ ELSTAN ANTHONY |
分类号 |
H01L23/495;H01L21/60;H01L21/603;H01L21/607;H01L21/98;H01L23/538;H01L25/065 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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