发明名称 Light fixture assembly having improved heat dissipation capabilities
摘要 A light fixture assembly including an illumination assembly in the form of one or more light emitting diodes is interconnected to an electrical energy source by control circuitry. A mounting assembly supports the illumination assembly and a cover structure is disposed in heat transferring relation to the mounting assembly, wherein both the mounting assembly and the cover structure are formed of conductive material, thereby effectively dissipating the heat generated by the LED illumination assembly. The illumination assembly is connected to a source and electric energy by a conductor assembly comprising one or more conductive material connectors mechanically interconnecting components of the light fixture into an assembled orientation. A non-conductive insulation assembly isolates each of the one or more conductive connectors from the mounting assembly to avoid electrical contact there between.
申请公布号 US7878692(B2) 申请公布日期 2011.02.01
申请号 US20070985055 申请日期 2007.11.13
申请人 INTELTECH CORPORATION 发明人 SODERMAN DARYL;STEPPS DALE B.
分类号 F21V29/00 主分类号 F21V29/00
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