SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND CAMERA

摘要

PURPOSE: A solid imaging device, a manufacturing method thereof, and a camera are provided to improve sensitivity by decreasing the overlapping of color filters in a pixel boundary inside a first pixel group which is composed of green pixels. CONSTITUTION: A signal reading part deciphers a voltage according to a signal charge. An insulating layer is formed on a semiconductor substrate in order to coat photodiodes and comprises an optical waveguide. Color filters are formed on the insulating layer. On-chip lenses are formed on the color filters. A first pixel combination(1) and a second pixel combination(2) are sequentially arranged in both of a horizontal direction and a vertical direction.