| 摘要 |
PURPOSE: A semiconductor device is provided to minimize the chip size of a semiconductor chip by using a short side directional layout arrangement in a rectangle-shaped semiconductor chip. CONSTITUTION: An input protection circuit(3a~3c) is arranged in the lower layer of an input bump among a plurality of input bump electrodes. A SRAM(2a~2c) is arranged in the lower layer of input bump electrode among the plurality of input bump electrodes. An internal circuit is formed in a semiconductor chip. |
