METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A manufacturing method is provided to improve the signal transmission speed of a semiconductor package by forming a coreless package substrate. CONSTITUTION: A first and a second carrier substrate(110,210) face each other between an adhesive member. A first and a second semiconductor chip are mounted on one side of the first and the second carrier substrate. At least one layer first and second build-up layer(140,240), which is electrically connected to the first and the second semiconductor chip, is formed on one side of the first and the second carrier substrate. The first carrier substrate and the second carrier substrate are separated from the adhesive member.