APPARATUS AND UNIT FOR PROCESSING A SUBSTRATE

摘要

PURPOSE: A substrate processing device is provided to reduce the thickness of a device by reducing an interval between an electrode plate and a shower head. CONSTITUTION: A heater plate heats a substrate placed in an upper part. A high frequency is applied to an electrode plate and reaction gas flows into the plate. A shower head(30) is arranged between the electrode plate and the heater plate. The shower head has a plurality of spray holes in order to uniformly supply the reaction gas to the substrate. A supporter(40) includes a support part and an extension part. An electrode sheet(50) electrically connects the support part to a stepped part in a location adjacent to the support part.