| 摘要 |
<p>The present invention relates to a device for thermally treating workpieces, in particular printed circuit boards or the like that are equipped with electrical and electronic components, comprising at least one process chamber in which at least one heating or cooling zone is formed or disposed, wherein a temperature-controlled gaseous fluid can be introduced into said heating or cooling zone, wherein the workpieces pass through the heating or cooling zone and heat is transferred particularly in a convective manner between the workpieces and the temperature-controlled fluid, and comprising at least one temperature measuring element disposed in the process chamber, wherein at least one sensor element that has a defined mass is disposed in the process chamber, such that heat is convectively transferred between the sensor element and the fluid, and an apparatus is provided for cooling and/or heating the sensor element, wherein the temperature of the sensor element can be measured by the temperature measuring element.</p> |
