发明名称 |
METHOD FOR PRODUCING PLATED MOLDED PRODUCT |
摘要 |
A METHOD FOR PRODUCING A PLATED MOLDED PRODUCT IS PROVIDED, IN WHICH A SURFACE OF A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY COINJECTION MOLDING OF RESIN IS SUBJECTED TO PLATING. A SURFACE OF A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY HIGH-SPEED INJECTION MOLDING OF RESIN IS PLATED BY STEPS: ( A ) FORMING A METAL PLATING LAYER ON A SURFACE OF THE MOLDED PRODUCT BY ELECTROLESS PLATING; ( B ) FORMING A COPPER PLATING LAYER ON A SURFACE OF THE ELECTROLESS PLATING LAYER BY ELECTROPLATING; ( C ) FORMING A NICKEL LAYER ON A SURFACE OF THE COPPER PLATING LAYER BY ELECTROPLATING; AND ( D ) FORMING A CHROMIUM OR CHROMIUM ALLOY LAYER ON A SURFACE OF THE NICKEL LAYER BY ELECTROPLATING . EVEN FOR A MOLDED PRODUCT HAVING A THIN PORTION OBTAINED BY HIGH-SPEED INJECTION MOLDING, A PLATING WHICH RESISTS REMOVAL CAN BE OBTAINED. FURTHER, EVEN WHEN A PLATING IS FORMED ON A SATIN-FINISHED SURFACE, THE PLATING CAN REPRODUCE THE SATIN-FINISHED SURFACE.
|
申请公布号 |
MY142899(A) |
申请公布日期 |
2011.01.31 |
申请号 |
MYPI20020502 |
申请日期 |
2002.02.14 |
申请人 |
TAIYO MANUFACTURING CO., LTD. |
发明人 |
ICHIRO HAYASHI;KAZUHIRO MIYOKAI |
分类号 |
C23C18/24;C25D3/06;C25D5/14;C25D5/56 |
主分类号 |
C23C18/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|