| 摘要 |
Chemical and mechanical polishing apparatus, for polishing object (100) having surfaces on two opposite sides, has a rotatable surface plate to which a polishing pad (220) is attached via a soft elastic pad (210) and a carrier (1) with a support surface for supporting the object to be polished. A pressure pad (7) attached to the support surface of the carrier urges the object to be polished against the polishing pad. It is a thin, porous, elastic member which maintains the second surface of the object in a flat state when it is urged against the polishing pad. Holder (40) on the carrier holds the object to be polished on the pressure pad while the second surface of the object is urged into contact with the rotating polishing pad. Also claimed is similar apparatus except for the pressure pad which is a thick, porous, elastic member which is deformable along a contour of the second surface of the object to maintain that surface of the object in a flat state when urging the object against the polishing pad. |
