发明名称 |
METHOD FOR FABRICATING CU METAL WIRE AND AN ARRAY SUBSTRATE FOR LCD INCLUDING THE CU METAL WIRE |
摘要 |
PURPOSE: A copper wire forming method and an array substrate for an LCD display device including a copper wire are provided to form a barrier layer comprised of a Cu2O in front side of the substrate and form copper pattern on upper part of the substrate, thereby providing reliable metal lines. CONSTITUTION: A Cu2O barrier layer(320) is evaporated in front side of the substrate(212). A copper metal layer is mounted on upper part of the CU2O barrier layer. A copper metal layer is etched. The Cu2O barrier layer and copper metal layer inside a same chamber is evaporated continuously. To form a Cu2O by reacting with a copper, the Cu2O barrier copper is formed through a reactive sputtering method injecting an inert gas including oxygen into the chamber. |
申请公布号 |
KR20110009953(A) |
申请公布日期 |
2011.01.31 |
申请号 |
KR20090067409 |
申请日期 |
2009.07.23 |
申请人 |
LG DISPLAY CO., LTD. |
发明人 |
YANG, HEE JUNG;HONG, SEOK CHEON;HAN, GYU WON;HO, WON JOON |
分类号 |
G02F1/136;G02F1/1343 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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