发明名称 COUPON BOARD AND MANUFACTURING METHOD OF PRINTED BOARD
摘要 A coupon board is cut out together with a printed wiring board from a sheet material in which a solder resist film is formed on a surface of a glass cloth fiber. The coupon board is for evaluating characteristics of the printed wiring board. The coupon board includes a region on which the solder resist film is not formed, and which extends parallel with one side of the printed wiring board.
申请公布号 US2011018552(A1) 申请公布日期 2011.01.27
申请号 US20100828776 申请日期 2010.07.01
申请人 FUJITSU LIMITED 发明人 SUGIMOTO KAORU;KOBAYASHI KATSUHIKO
分类号 H01H31/02;B05D5/12 主分类号 H01H31/02
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