发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 A wiring board has a first rigid wiring board having an accommodation section, a second rigid wiring board to be accommodated in the accommodation section, and an insulation layer formed on the first rigid wiring board and the second rigid wiring board. Here, a conductor of the first rigid wiring board and a conductor of the second rigid wiring board are electrically connected to each other, and at least either a side surface of the second rigid wiring board or a wall surface of the accommodation section has a concave-convex portion.
申请公布号 US2011019383(A1) 申请公布日期 2011.01.27
申请号 US20100694660 申请日期 2010.01.27
申请人 IBIDEN CO., LTD 发明人 AOYAMA MASAKAZU;NOGUCHI HIDETOSHI
分类号 H05K1/11 主分类号 H05K1/11
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