发明名称 METHOD FOR CONNECTING ELECTRODES AND CONNECTION COMPOSITION USED THEREFOR
摘要 <p>Disclosed is a method for connecting electrodes, wherein a first connection part that is formed on a transparent substrate (21) and comprises a first electrode (11) and a second connection part that is formed on a flexible substrate (11) and comprises a second electrode (12) are bonded with each other and the first electrode and the second electrode are electrically connected with each other. The method for connecting electrodes comprises : a step in which a connection composition (13, 14), which contains (a) a curable resin component and (b) a photocuring initiator component and which is delayed curable by irradiation of light, is applied to either the first connection part and/or the second connection part; a first light irradiation step in which the applied connection composition is irradiated with light; and a second light irradiation step in which the first connection part and the second connection part are pressed against each other before the connection composition is cured, while aligning the first electrode and the second electrode, and then the connection composition is further irradiated with light.</p>
申请公布号 WO2011010692(A1) 申请公布日期 2011.01.27
申请号 WO2010JP62346 申请日期 2010.07.22
申请人 HENKEL CORPORATION;IIDA, KAZUTOSHI;CHEN, CHUNFU 发明人 IIDA, KAZUTOSHI;CHEN, CHUNFU
分类号 H05K3/36;G02F1/1345;G09F9/00;H05K1/14 主分类号 H05K3/36
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