| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper plating method by which a plating film having a priority orientation surface to become (200) plane and having excellent film physical properties is obtained.SOLUTION: The electroplating is carried out by adding an additive comprising a copolymer of at least diallyl dialkyl ammonium alkyl sulfate, acryl amides and sulfur dioxide and other required additives into a plating solution containing copper sulfate as a main ingredient and alternately carrying out a high current density electroplating and a low current density electroplating, or alternately carrying out electroplating by a PR pulse (polarity inversion pulse), or alternately carrying out electrolytic copper plating and displacement plating, or electrolytic copper plating and micro-etching, or combining two or more of the plating processes. |
