| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition film allowing formation of a film having superior heat resistance, in which a high-resolution pattern can be formed without producing undercut at patterning.SOLUTION: The photosensitive resin composition contains: (a) a polyimide, having at least one group selected from among the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group at a terminal of the main chain; (b) an unsaturated bond-containing polymerizable compound; (c) an imidazole silane; and (d) a photopolymerization initiator. |
