| 摘要 |
PROBLEM TO BE SOLVED: To provide a high thermal conductivity resin composition which is excellent particularly in thermal conductivity and insulation, ensures good moldability, surface smoothness and dimensional stability, is inexpensive and easy to produce, and to provide a molding thereof.SOLUTION: The high thermal conductivity resin composition comprises (A) 20-85 mass% of a thermoplastic resin, (B) 5-30 mass% of platy graphite having apparent density of ≥0.16 g/cm, and (C) 10-60 mass% of a filler having electric insulation. The molding is a high thermal conductivity resin molding obtained by molding the high thermal conductivity resin composition. |
