FILM FORMING DEVICE AND FILM FORMING METHOD

摘要

PURPOSE: A film forming device and a film forming method are provided to perform uniform plating by eliminating evaporative materials from an evaporation source. CONSTITUTION: A film forming device comprises a vacuum metalizing chamber. The vacuum metalizing chamber comprises an evaporation source moving unit and a cleaning unit(21). The evaporation source moving unit evaporates or sublimates evaporative materials in an evaporation source(70). The evaporation source is plated on a substrate. The cleaning unit eliminates the evaporated materials extracted from nozzles.