| 摘要 |
PROBLEM TO BE SOLVED: To provide a wet etching system and a patterning method which can form a fine circuit pattern without causing a failure in the shape (while maintaining particularly the width of an upper part of circuit wiring).SOLUTION: The wet etching system includes: an exposure means for exposing a copper-containing material having a surface on which a pattern of a positive type photosensitive resist has been formed, to light; and a wet etching means for wet-etching the copper-containing material exposed to light by the exposure means. The method for patterning the copper-containing material includes: exposing the copper-containing material having the surface on which the pattern of the positive type photosensitive resist has been formed, to light; and wet-etching the exposed material by using an etchant composition formed of an aqueous solution which includes: (A) 0.1-15 mass% of at least one oxidizing agent component selected from a cupric ion and a ferric ion; and (B) 0.001-5 mass% of a compound that has been prepared by adding at least one selected from ethylene oxide and propylene oxide to active hydrogen of a (poly)amine compound. |
