| 发明名称 |
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF |
| 摘要 |
A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
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| 申请公布号 |
US2011018084(A1) |
申请公布日期 |
2011.01.27 |
| 申请号 |
US20100892907 |
申请日期 |
2010.09.28 |
| 申请人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN |
发明人 |
SHIM IL KWON;HAN BYUNG JOON;RAMAKRISHNA KAMBHAMPATI;CHOW SENG GUAN |
| 分类号 |
H01L31/0203;H01L21/56;H01L31/18 |
主分类号 |
H01L31/0203 |
| 代理机构 |
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