发明名称 HOTMELT ADHESIVES HAVING AN EXTENDED OPEN TIME
摘要 The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-α-olefin which is solid at 25° C. and at least one soft resin having a melting point or softening point between −10° C. and 40° C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.
申请公布号 US2011020634(A1) 申请公布日期 2011.01.27
申请号 US20090921498 申请日期 2009.04.28
申请人 SIKA TECHNOLOGY AG 发明人 PASCHKOWSKI KAI;CORDES MATHIAS
分类号 B32B7/12;B32B27/04;B32B27/32;B32B37/14;C09J123/00 主分类号 B32B7/12
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