| 发明名称 |
METHOD FOR PRODUCING LASER-MARKED SEMICONDUCTOR WAFER |
| 摘要 |
A laser-marked semiconductor wafer having a good flatness in the vicinity of laser mark-printed sites is produced by a method comprising a slicing step; a planarization step; a laser mark printing step; a grinding step; an etching step; and a polishing step.
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| 申请公布号 |
US2011021025(A1) |
申请公布日期 |
2011.01.27 |
| 申请号 |
US20100841015 |
申请日期 |
2010.07.21 |
| 申请人 |
SUMCO CORPORATION |
发明人 |
HASHII TOMOHIRO;AOKI KENJI |
| 分类号 |
H01L21/302 |
主分类号 |
H01L21/302 |
| 代理机构 |
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