发明名称 CURABLE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR AND CURED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition that is excellent in prevention of depressed areas after heat curing and in resistance to corrosive gas and is also excellent in coloring resistance; and a cured product thereof.SOLUTION: The curable resin composition contains an epoxy resin represented by formula (1), wherein a plurality of Rs each independently exists and is a hydrogen atom or a methyl group, a curing agent and/or a curing accelerator. The depressed areas after heat curing are effectively prevented when cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride and methylhexahydrophthalic anhydride are simultaneously used as curing agents in the curable resin composition.
申请公布号 JP2011016880(A) 申请公布日期 2011.01.27
申请号 JP20090161089 申请日期 2009.07.07
申请人 NIPPON KAYAKU CO LTD 发明人 KAWADA YOSHIHIRO;NAKANISHI MASATAKA;KUBOKI KENICHI;MIYAGAWA NAOFUSA;SASAKI TOMOE;AOKI SHIZUKA;SUZUKI ZUIKAN;KOYANAGI TAKAO
分类号 C08G59/24;H01L23/29;H01L23/31;H01L33/56 主分类号 C08G59/24
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